Curing Large Parts by Changing Device Geometry

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JohnStack
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Curing Large Parts by Changing Device Geometry

Postby JohnStack » Sun Aug 24, 2014 7:57 pm

Over the weekend, I was thinking that larger parts could be cured by changing to larger petrie dishes, substrate location (bed), and projection dimensions.

It's my guess that higher resolution (1080i/p) projectors would have to be used - which then led me to trying to figure out the differences in DLP chipsets. TI and Mitsubishi make some of the chips. Looking at IT, there's a 055 DLP, 065 DLP and something called a 1080p DLP DarkChip technology - supporting home theatre.



On a separate note, I found this little jewel that very nicely explains DLP and printing. The interesting thing that I saw was the "inkjet" parts. Hmmm...so if Z went in reverse and there was a curing vat that supported that...next model John?

http://www.ti.com/solution/dlp_3d_printer#Tools and Software

And a decent high level on DMD for projectors.

http://www.globalprojectors.com/The-imp ... _58-1.html
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